A facile and scalable lithography-free fabrication technique, named solution-processable electrode-material embedding in dynamically inscribed nanopatterns (SPEEDIN), is developed to produce highly durable electronics. SPEEDIN uniquely utilizes a single continuous flow-line manufacturing process comprised of dynamic nanoinscribing and metal nanoparticle solution coating with selective embedding. Nano- and/or micro-trenches are inscribed into arbitrary polymers, and then an Ag nanoparticle solution is dispersed, soft-baked, doctor-bladed, and hard-baked to embed Ag micro- and nanowire structures into the trenches. Compared to lithographically embossed metal structures, the embedded SPEEDIN architectures can achieve higher durability with comparable optical and electrical properties and are robust and power-efficient even under extreme stresses such as scratching and bending. As one tangible application of SPEEDIN, we demonstrate a flexible metal electrode that can operate at 5 V at temperatures up to 300 °C even under the influence of harsh external stimuli. SPEEDIN can be applied to the scalable fabrication of diverse flexible devices that are reliable for heavy-duty operation in harsh environments involving high temperatures, mechanical deformations, and chemical hazards.